are divided into Mechanical and Mechatronics Engineering, Electronics
Engineering, Computer Science and Signal Processing departments.
The facility comprises 1200m² of offices and laboratories, 3500m²
of test ground areas including all types of soil conditions (asphalt,
soft soils, sand, rocks, etc) as well as underwater robot test pools
Eng dep comprises advanced metal machining workshop including robotised
aluminium alloy welding posts, large scale laser 3D scanner facility,
as well as carbon fibre / glass fibre composite material assembly
workshop. Component design is based on fully parametric software
packages (Intergraph Solid Edge TM, Pro-Engineer), while machining
is driven by MasterCAM TM.
Eng. dep covers the full range of design and manufacturing of micro-controller
based modular control cards, including power electronics and power
supplies. Design is supported by ORCAD while CNC machines are used
for PCB hole drilling and fast prototyping. CAFD is used for cooling
elements and packaging verification.
develoment in Computer science and Signal processing is supported
by Linux and QNX RT systems on Sun Workstations and PCs. Fast Ethernet
network is used within the facility as well as a 155Mb fibre optic
ATM local ring supported by a ASX 200 BX (Fore) switch.